Practical Application of Mathematical Modelling On the Copper-Base Connector Design (gh)

1. General description

The stress relaxation for a model connector has been earlier [1] simulated using a 2-D Finite Element Method. The temperature field, stress and the contact loads were calculated. It has been concluded that the model facilitates selection of the best alloy for given conditions. This may be great value since design and testing of a connector are expensive [1].
In view of ten years progress in both hardware and software technologies, the following proposal is made. The result will be used to develop a mathematical model of the temperature and stress/strain fields for different copper-base alloy, and thereby to be used as a tool for copper-base connector design.


2. Target, Objectives and part goals

The model will ultimately be applied to assist on the design of copper-base connector based on:

- Thermodynamic study of different base material mainly:
- Simulation of different operating parameters
- Optimization tool for different material under different operating parameter

3. Phases and activities

The objective can be divided in the following steps:

Part 1) Thermodynamic study of different base material, including:
F10) Evaluation of different existing softwares and choosing the most suitable one;
F20) Modifying the software;
F30) Testing the program to be able to use the computed/predicted results,
F40) Studying the thermodynamic behaviour of different alloy:
i) CuNi/CoSi
ii) CuCr
iii) CuCoP

F50) Comparing the efficiency of different material subjected in F40.

Part 2) Simulation of different operating parameters such as:
F10) Temperature distribution
F20) Stress/strain fields
F30) Contact loads
F40) Contact resistance

Part 3) Optimization of different material under different operating parameter