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Reliability of OSP on electronic boards
Background: Organic solderability preservatives (OSP) is a thin organic layer (0.2 to 0.5 ?m) used on electronic boards to protect the copper pads from oxidation prior to soldering of the components. Its use in electronic industry tends to increase considerably, some of its main advantages compared to other protecting layers being a low cost and flat pads. One of the traditional concerns with OSP is that it can not withstand several excursions through a soldering furnace (what is necessary in electronics today). However, the new generation of OSP films is said by the producer to be able to resist to at least 3 excursions in the furnace. Nevertheless, a previous study at IM showed important variations of the solderability and resistance to oxydation of OSP boards submitted to several excursions in the furnace. The reasons for these variations need to be understood in order to improve the process.
Experimental work: ViaSystems Sweden AB (which is a producer of electronic boards for Ericsson) is providing the boards. Boards which has been submitted to different numbers of excursions in a soldering furnace will be used. The solderability will be evaluated by using a wetting balance. The structure and composition of the surface will be studied with different methods (for example scanning electron microscope and GDOES). Corrosion testing may also be included in this work.
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